Modeling and Simulation for Microelectronic Packaging Assembly

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Product Information[size=0.875]Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Cover
Title Page
Copyright
Foreword by C. P. Wong
Foreword by Zhigang Suo
Preface
Acknowledgments
About the Authors
Part I: Mechanics and Modeling
Chapter 1: Constitutive Models and Finite Element Method
1.1 Constitutive Models for Typical Materials
1.2 Finite Element Method
1.3 Chapter Summary
References
Chapter 2: Material and Structural Testing for Small Samples
2.1 Material Testing for Solder Joints
2.2 Scale Effect of Packaging Materials
2.3 Two-Ball Joint Specimen Fatigue Testing
2.4 Chapter Summary
References
Chapter 3: Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution
3.1 Constitutive Model for Tin-Lead Solder Joint
3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills
3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
3.4 User-Supplied Subroutines for Solders Considering Damage Evolution
3.5 Chapter Summary
References
Chapter 4: Accelerated Fatigue Life Assessment Approaches for Solders in Packages
4.1 Life Prediction Methodology
4.2 Accelerated Testing Methodology
4.3 Constitutive Modeling Methodology
4.4 Solder Joint Reliability via FEA
4.5 Life Prediction of Flip-Chip Packages
4.6 Chapter Summary
References
Chapter 5: Multi-Physics and Multi-Scale Modeling
5.1 Multi-Physics Modeling
5.2 Multi-Scale Modeling
5.3 Chapter Summary
References
Chapter 6: Modeling Validation Tools
6.1 Structural Mechanics Analysis
6.2 Requirements of Experimental Methods for Structural Mechanics Analysis
6.3 Whole Field Optical Techniques
6.4 Thermal Strains Measurements Using Moir＆#x00E9; Interferometry
6.5 In-Situ Measurements on Micro-Machined Sensors
6.6 Real-Time Measurements Using Speckle Interferometry
6.7 Image Processing and Computer Aided Optical Techniques
6.8 Real-Time Thermal-Mechanical Loading Tools
6.9 Warpage Measurement Using PM-SM System
6.10 Chapter Summary
References
Chapter 7: Application of Fracture Mechanics
7.1 Fundamental of Fracture Mechanics
7.2 Bulk Material Cracks in Electronic Packages
7.3 Interfacial Fracture Toughness
7.4 Three-Dimensional Energy Release Rate Calculation
7.5 Chapter Summary
References
Chapter 8: Concurrent Engineering for Microelectronics
8.1 Design Optimization
8.2 New Developments and Trends in Integrated Design Tools
8.3 Chapter Summary
References
Part II: Modeling in Microelectronic Packaging and Assembly
Chapter 9: Typical IC Packaging and Assembly Processes
9.1 Wafer Process and Thinning
9.2 Die Pick Up
9.3 Die Attach
9.4 Wire Bonding
9.5 Molding
9.6 Leadframe Forming/Singulation
9.7 Chapter Summary
References
Chapter 10: Opto Packaging and Assembly
10.1 Silicon Substrate Based Opto Package Assembly
10.2 Welding of a Pump Laser Module
10.3 Chapter Summary
References
Chapter 11: MEMS and MEMS Package Assembly
11.1 A Pressure Sensor Packaging (Deformation and Stress)
11.2 Mounting of Pressure Sensor
11.3 Thermo-Fluid Based Accelerometer Packaging
11.4 Plastic Packaging for a Capacitance Based Accelerometer
11.5 Tire Pressure Monitoring System (TPMS) Antenna
11.6 Thermo-Fluid Based Gyroscope Packaging
11.7 Microjets for Radar and LED Cooling
11.8 Air Flow Sensor
11.9 Direct Numerical Simulation of Particle Separation by Direct Current Dielectrophoresis
11.10 Modeling of Micro-Machine for Use in Gastrointestinal Endoscopy
11.11 Chapter Summary
References
Chapter 12: System in Package (SIP) Assembly
12.1 Assembly Process of Side by Side Placed SIP
12.2 Impact of the Nonlinear Materials Behaviors on the Flip-Chip Packaging Assembly Reliability
12.3 Stacked Die Flip-Chip Assembly layout and the Material Selection
12.4 Chapter Summary
References
Part III: Modeling in Microelectronic Package Reliability and Test
Chapter 13: Wafer Probing Test
13.1 Probe Test Model
13.2 Parameter Probe Test Modeling Results and Discussions
13.3 Comparison Modeling: Probe Test versus Wire Bonding
13.4 Design of Experiment (DOE) Study and Correlation of Probing Experiment and FEA Modeling
13.5 Chapter Summary
References
Chapter 14: Power and Thermal Cycling, Solder Joint Fatigue Life
14.1 Die Attach Process and Material Relations
14.2 Power Cycling Modeling and Discussion
14.3 Thermal Cycling Modeling and Discussion
14.4 Methodology of Solder Joint Fatigue Life Prediction
14.5 Fatigue Life Prediction of a Stack Die Flip-Chip on Silicon (FSBGA)
14.6 Effect of Cleaned and Non-Cleaned Situations on the Reliability of Flip-Chip Packages
14.7 Chapter Summary
References
Chapter 15: Passivation Crack Avoidance
15.1 Ratcheting-Induced Stable Cracking: A Synopsis
15.2 Ratcheting in Metal Films
15.3 Cracking in Passivation Films
15.4 Design Modifications
15.5 Chapter Summary
References
Chapter 16: Drop Test
16.1 Controlled Pulse Drop Test
16.2 Free Drop
16.3 Portable Electronic Devices Drop Test and Simulation
16.4 Chapter Summary
References
Chapter 17: Electromigration
17.1 Basic Migration Formulation and Algorithm
17.2 Electromigration Examples from IC Device and Package
17.3 Chapter Summary
References
Chapter 18: Popcorning in Plastic Packages
18.1 Statement of Problem
18.2 Analysis
18.3 Results and Comparisons
18.4 Chapter Summary
References
Part IV: Modern Modeling and Simulation Methodologies: Application to Nano Packaging
Chapter 19: Classical Molecular Dynamics
19.1 General Description of Molecular Dynamics Method
19.2 Mechanism of Carbon Nanotube Welding onto the Metal
19.3 Applications of Car＆#x2013arrinello Molecular Dynamics
19.4 Nano-Welding by RF Heating
19.5 Chapter Summary
References
Index